We have already introduced hot melt adhesive film, which requires three process elements: temperature, pressure and time. As the application of hot melt adhesive film becomes more and more extensive, more and more new materials are trying to use hot melt adhesive film for bonding. At the same time, many problems will be encountered because different materials have their characteristics. Additionally, if you do not understand the properties of the film itself, you will often discover some uncomfortable situations.
When customers use hot-melt adhesive film, there is a situation that the material itself is deformed when the hot-melt adhesive film is not melted during hot pressing.
This is due to the fact that every material has a temperature range that it can withstand, some materials can withstand high temperatures, and some materials can withstand low temperatures. When the temperature resistance of our material itself is not high, it is easy to be deformed by heat. And when we choose hot melt adhesive film to bond this material, we must consider this temperature condition. If the melting temperature of the selected hot-melt adhesive film is similar to the temperature resistance temperature of the material to be adhered to, even if the hot-melt adhesive film is melted, the material will become soft. Under the simultaneous action of pressure, the material will be affected. Compression deformation, let alone bonding, the material will be scrapped directly.
So, how can we solve this problem? In fact, we only need to deliberately choose a low-temperature hot melt adhesive film for material bonding. As long as the use temperature of the hot melt adhesive film is lower than the softening temperature of the material itself, it can ensure that the adhered material will not be deformed during the hot pressing process. When material developers select the type of hot melt adhesive film, they need to take this problem into consideration in advance and narrow the range of hot melt adhesive film models to achieve a multiplier effect with half the effort.